Electronic Chemicals

XHPDSERIES EMC

XHPD series Epoxy Moulding Compound is a specially formulated product designed for use in high volume moulding of tantalum capacitor. It is designed to give optimum overall performance and features:Low Moisture Absorption, Outstanding Purity, Excellent Moldability, Fist Cycle Time, Temperature Cycling Stability,Lasermark Capability.

1、Typical Properties of XHPD Series EMC

（1）Typical uncurl properties：

Item	XHPD-1	XHPD-2	Test method
color	Yellow、Blue, Black	Yellow	Visual
shape	Powder or Cake	Pellet（Ф13mm）
Spiral Flow 150℃,inches	20～28	9～17	JB3757-1984
Hot Plate Gel Time175℃，s	14～20	10～16	Q/320200 NA028-2003
Shelf Life, Under 10℃, From Date of manufacture,Months	7	7

（2）Typical CuredProperties：

Item	XHPD-1	XHPD-1	Test method
Glass TransitionTemperature℃	>150	>160	Q/320200 NA028-2003
Coefficient of Thermal Expansion， in/in/℃	<27×10－6	<22×10－6
Coefficient of Thermal Expansion， in/in/℃	<80×10－6	<75×10－6
Specific Gravity	1.75～1.85	1.85～1.95	GB/T1033-1986
Flexural Strength,MPa	>120	>130	GB/T9341-2000
Flexural Modulus, GPa	>13	>14	GB／T9341－2000
Impact Strength,KJ／m2	>6	>8	GB／T1043－1993
surface Resistivity,Ω	>1.0×1015	>1.0×1015
Volume Resistivity, Ω.cm	>1.0×1015	>1.0×1015

（3）Water Extract Data;20hrs water boil：

Item	XHPD-1	XHPD-2
Cl- contentppm	<6	<5
Na+ contentppm	<9	<5
pH	6.5	6.5
conductivity,μυ	50	20

2、Recommended for molding condition:

Item	XHPD-1	XHPD-2
Preheat Temperature,℃	70～100	/
Mold Temperature, ℃	140～190	150～180
Transfer Pressure, MPa	3～10	3～10
Cure Time，170℃，s	60～150	45～120
Post Cure Time，165℃，hr	3～6	2～4

3、Note

（1）EMC shall be kept at place 5℃ or blow. The polyethylene bag shall be kept closed. Avoid storaging in the places of high humidity and do not expose to the sun.

（2）From storage to molding, the EMC must be allowed to come to room temperature more than 16hr,in the sealed containers.Use up within 72hrs.

Electronic Chemicals XHPDSERIES EMC

Electronic Chemicals

XHPDSERIES EMC